ACTUS® MODULE
CHARACTERISTICS
Boson+ IQ Development Kit - Qualcomm
MODULE
The Boson®+ IQ Development Kit is a reference hardware design and software development platform that enables integrators to evaluate and develop thermal infrared (IR) sensing with AI object detection and image signal processing (ISP) at the edge. Based on the Teledyne FLIR AVP, featuring a Qualcomm® Dragonwing™ QCS8550 system on chip (SoC), it delivers industry-leading 50 trillion operations per second (TOPS) calculation performance. The multicore architecture features two DSP cores for inference, 8 CPU cores for general compute, and a GPU for computational imaging functions. The typical power addition is just 2.5 watts, simplifying thermal management and maximizing future mission duration while operating Prism™ AI object detection models and Prism ISP denoising, super resolution, and automatic gain control (AGC) for superior image quality.
Engineered with integrators in mind, the Boson+ IQ Development Kit simplifies integration with three MIPI interfaces for the included Boson+ thermal camera module and additional cameras. The software development kits (SDK), hardware ICD, and comprehensive expert-level engineering support ensure a seamless development experience. The platform is also forward-compatible with future Prism software enhancements, such as Prism SKR and more, making it a future-ready solution for edge AI thermal imaging applications.
SPECIFICATIONS
EVALUATE AND DEVELOP THERMAL WITH EDGE AI
Access Prism software IR object detectors, advanced ISP, and future additions
Prism AI real time decision support detection and multi object tracking
Prism ISP imaging with super-resolution, noise reduction, and more
Future compatibility with visual navigation and Prism SKR autonomous target detection
16-bit real-time recording for offline video pipeline and AI model development
DEVELOP ON THE QUALCOMM DRAGONWING
QCS8550 PLATFORM
Premium processor enables extreme edge AI at low power
Industry-leading 50 TOPS total compute
Low 2.5 W input power and thermal load running 100% DSP, 60% GPU, and two CPU cores
640x512 Boson+ thermal camera module interface
Three MIPI interfaces for two thermal and one visible camera
DESIGNED FOR INTEGRATORS
Simplify development and reduce risk with software and support
Boson+ and Prism SDKs
640x512 Boson+, MIPI interface board, cable, and carrier board
User-friendly graphical user interface (GUI)
Development support by qualified application engineers
Boson+ IQ Development Kit - Qualcomm
ACTUS MODULE
ACTUS® MODULE
CHARACTERISTICS
Boson+ IQ Development Kit - Qualcomm
MODULE
The Boson®+ IQ Development Kit is a reference hardware design and software development platform that enables integrators to evaluate and develop thermal infrared (IR) sensing with AI object detection and image signal processing (ISP) at the edge. Based on the Teledyne FLIR AVP, featuring a Qualcomm® Dragonwing™ QCS8550 system on chip (SoC), it delivers industry-leading 50 trillion operations per second (TOPS) calculation performance. The multicore architecture features two DSP cores for inference, 8 CPU cores for general compute, and a GPU for computational imaging functions. The typical power addition is just 2.5 watts, simplifying thermal management and maximizing future mission duration while operating Prism™ AI object detection models and Prism ISP denoising, super resolution, and automatic gain control (AGC) for superior image quality.
Engineered with integrators in mind, the Boson+ IQ Development Kit simplifies integration with three MIPI interfaces for the included Boson+ thermal camera module and additional cameras. The software development kits (SDK), hardware ICD, and comprehensive expert-level engineering support ensure a seamless development experience. The platform is also forward-compatible with future Prism software enhancements, such as Prism SKR and more, making it a future-ready solution for edge AI thermal imaging applications.
SPECIFICATIONS
EVALUATE AND DEVELOP THERMAL WITH EDGE AI
Access Prism software IR object detectors, advanced ISP, and future additions
Prism AI real time decision support detection and multi object tracking
Prism ISP imaging with super-resolution, noise reduction, and more
Future compatibility with visual navigation and Prism SKR autonomous target detection
16-bit real-time recording for offline video pipeline and AI model development
DEVELOP ON THE QUALCOMM DRAGONWING
QCS8550 PLATFORM
Premium processor enables extreme edge AI at low power
Industry-leading 50 TOPS total compute
Low 2.5 W input power and thermal load running 100% DSP, 60% GPU, and two CPU cores
640x512 Boson+ thermal camera module interface
Three MIPI interfaces for two thermal and one visible camera
DESIGNED FOR INTEGRATORS
Simplify development and reduce risk with software and support
Boson+ and Prism SDKs
640x512 Boson+, MIPI interface board, cable, and carrier board
User-friendly graphical user interface (GUI)
Development support by qualified application engineers
Boson+ IQ Development Kit - Qualcomm
ACTUS MODULE
